SMD-Developed in 2009 and successfully mass-produced
Infrared cut-off filter-successfully developed and mass produced in 2016
Glass-ceramic mobile phone panel-successfully developed and mass produced in 2018
Wafers, silicon wafers and other products-successfully developed and mass produced in 2020
Successfully realized the automated transformation of automated polishing machines, automated engraving machines and other equipment and applied for national patents.
Outer diameter size | 1.6mm×1.1mm、5mm×2.5mm |
Frequency tolerance | 150kHZ |
Minimum thickness | 0.022mm |
Frequency | 212.5M——48M |
Fundamental frequency | 74.45M——16M |
*Remarks: | Can be customized according to customer needs |
Processing equipment | Inspection equipment | ||
Outer diameter size | 77mm×77mm |
Outer diameter tolerance | ±0.05mm |
Thickness size | 0.11mm、0.21mm、0.3mm |
Appearance quality | 20/10 |
Minimum thickness | 0.08mm |
TTV | <3μm |
*Remarks: | Can be customized according to customer needs |
Processing equipment | Inspection equipment | ||
Outer diameter size | 20——300mm |
Outer diameter tolerance | ±0.05mm |
Thickness size | 0.3mm——0.5mm |
TTV | <3μm |
Monolithic parallelism | ≤0.02 |
Appearance quality | 20/10 |
Roughness | Ra<5nm |
*Remarks: | Can be customized according to customer needs |
Processing equipment | Inspection equipment | ||