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Technical Strength

  • R&D results

    SMD-Developed in 2009 and successfully mass-produced

    Infrared cut-off filter-successfully developed and mass produced in 2016

    Glass-ceramic mobile phone panel-successfully developed and mass produced in 2018

    Wafers, silicon wafers and other products-successfully developed and mass produced in 2020

  • Supporting equipmentAutomation equipment, inspection equipment

    Successfully realized the automated transformation of automated polishing machines, automated engraving machines and other equipment and applied for national patents.

Product DevelopmentSMD
  • Outer diameter size1.6mm×1.1mm、5mm×2.5mm
    Frequency tolerance150kHZ
    Minimum thickness0.022mm
    Frequency212.5M——48M
    Fundamental frequency74.45M——16M
    *Remarks:Can be customized according to customer needs

Processing equipment

Inspection equipment

Product DevelopmentInfrared cut-off filter
  • Outer diameter size77mm×77mm
    Outer diameter tolerance±0.05mm
    Thickness size0.11mm、0.21mm、0.3mm
    Appearance quality20/10
    Minimum thickness0.08mm
    TTV<3μm
    *Remarks:Can be customized according to customer needs

Processing equipment

Inspection equipment

Product DevelopmentGlass-ceramic mobile phone panel
  • Outer diameter size20——300mm
    Outer diameter tolerance±0.05mm
    Thickness size0.3mm——0.5mm
    TTV<3μm
    Monolithic parallelism≤0.02
    Appearance quality20/10
    RoughnessRa<5nm
    *Remarks:Can be customized according to customer needs

Processing equipment

Inspection equipment