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Optical Products

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Glass wafer

Product introduction:

Through high-precision cutting, grinding, polishing and other cold processing processes of special materials, the surface roughness ≤1nm, TTV≤5μm and other surface requirements are met


Technical features and advantages:

The whole process of cold processing: products of different sizes of 4, 6, 8, and 12 inches can be provided


Product application:

Semiconductor substrate, semiconductor packaging, semiconductor bearing and other high-precision fields

Parameter

Specification

Material

Glass, quartz, etc.

Shape

Round

Outer diameter

3”——12”

Outer diameter size

76.2mm——300mm

Outer diameter tolerance

±0.05mm

Thickness

0.1mm——2.0mm

Minimum thickness

0.1mm

TTV

<3μm

BOW

<20μm

WARP

<30μm

Appearance quality

20/10

Roughness

Ra<5nm

Inverted edge

45°,C0.2+/-0.1mm

* Remarks: Can be customized according to customer needs